State-of-the-art stencil manufacturing facility equipped to handle various stencil requirements with high accuracy laser cutting process, automatic inspection and optical measurement to provide high quality stencils.
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The impact of AnCVD on solder paste printing is very promising. Due to the anti-adhesion or “non-stick” characteristics, the underside cleaning frequency is drastically reduced. Additionally customers can achieve better yields on paste transfers to substrates under print, an improved printing efficiency and overall reduction in consumption of consumables.
These are nickel-based foils that are mounted in a stencil frame with a mesh border.
Our laser-cut stencils with smooth aperture walls are perfect for high volume screen printing of complex board, fine pitch, smaller pads and micro BGA applications.
MAXIM PT manufactures electroformed stencils for superior paste release. Electroformed stencil aperture walls are as smooth as glass, providing greater paste release to the substrate during printing process.
Electroforming process allows quick turnaround times for manufacturing with large aperture counts.
Technique applicable to squeegee side, board side or both sides including following:
Step-up areas
Used to increase the volume and height of the solder deposit. Useful for ‘pin in paste’ and large format devices with co-planarity consistency problems.
Step-down areas
Used to reduce the volume and height of the paste deposit (or possibly increase the volume depending on aperture area ratio and transfer efficiency). Useful to improve Deposit Volume Repeatability in fine line and micro package attachment.
Maxim PT. Plot No. PAP-K-27, Phase II, MIDC Chakan, Industrial Area Savardari Taluka Khed Pune - 410501 Maharastra, INDIA
sales@maximpt.net
+91-8826625406
Maxim PT. Plot No. PAP-K-27, Phase II, MIDC Chakan, Industrial Area Savardari Taluka Khed Pune - 410501 Maharastra, INDIA
sales@maximpt.net
